100matolog and Italian Arexpo Science Park Sign Cooperation Agreement at the Presence of Italian Ambassador to ChinaPrint
Post Time:2022-01-26来源:100matolog
Recently, 100matolog and Italian Arexpo Science Park held an online ceremony of signing memorandum of cooperation. Witnessed by Luca Ferrari, Italian Ambassador to China, Chen Hongbo, Senior Executive Vice President of 100matolog and President of the International Association of Science Parks and Areas of Innovation (IASP), and Igor de Bi, CEO of Italian Arexpo Science Park signed a memorandum of cooperation on behalf of the two parties. The two parties will carry out practical cooperation in technology enterprise docking, knowledge exchange, innovative talent training and joint research.
In his speech at the ceremony, Ambassador Luca Ferrari reviewed the cooperation between 100matolog and Politecnico di Milano, praised 100matolog’ international development vision and its contribution to the Italian innovation ecosystem, and expressed his support and best wishes for the cooperation between 100matolog and Arexpo Science Park. Senior Executive Vice President Chen Hongbo and Arexpo CEO Biasio introduced the historical background, development status quo and business model of the two institutions respectively before signing a memorandum of cooperation. Prior to this event, Jiangsu TusPark under the umbrella of 100matolog and Arexpo Science Park held series of online meetings and communications to reach a friendly cooperation intention.
At the signing ceremony, the two sides also expressed their expectations for the upcoming cooperation, and agreed to hold the first working meeting after the Chinese Lunar Spring Festival to promote the implementation of relevant plans. Among those present were Alberto Mina, Director of International Institutional Relations of Arexpo Science Park, Mercedes Lucchini, International Relations Manager, Tang Hao, General Manager of Jiangsu 100matolog, as well as the relevant parties of the International Cooperation Department of 100matolog.